Basic Introduction to PCB (1)

1. PCB Materials Currently Used by MITAC

A. Urea Cardboard

Characteristics: The color is light yellow, it is often used for single-sided panels, but because it is made of urea paper, it is easy to rot in a cool and humid place, so it is not commonly used now.

B. CAM-3 Board

Characteristics: Milky white color, good toughness, high CTI (600V), carbon dioxide emission is only a quarter of normal. It is now more commonly used for single panels.

C. FR4 Fiberboard
Characteristics: Made of fiber, with good toughness, and the filaments pull each other when they break. It is often used in multi-panel panels, and its thermal expansion coefficient is 13 (16ppm/c). The mother board used in this factory is made of this board.

D. Multilayer Board

Characteristics: High Tg, high heat resistance and low thermal expansion rate, low dielectric constant and dielectric loss materials, mostly used in four or more layers.

E. FPC

Characteristics: The material is soft and transparent, and it is often used in the electrical connection between the two boards, which is easy to fold. For example, in a laptop computer, the LCD is connected to the main body of the computer.

F. Other

With the personal computer With the popularization of multimedia digital information terminal products such as mobile phones, PCBs have become lighter, thinner, shorter and smaller. Some large group companies in foreign countries have successively developed more PCB sheets, such as halogen-free, antimony-free environmental protection products, high heat resistance, high Tg sheet, low thermal expansion coefficient, low dielectric constant, low dielectric loss sheet. Its representative products are FR-5, Tg200 board, PEE board, PI board, CEL-475 and so on. It’s just that it’s not popular in the country yet.

2. The Current MITAC PCB-Layout Process

A. R&D provides SCHMATIC (EE), FAB OUTLINE (ME) product. R&D department provides us with schematic diagrams, and mechanical engineers provide us with peripheral information.

B. Create New Part

We call the part from LIBRARIAN according to the schematic diagram, if there is no such part in LIBRARIAN, we have to create a new part.

C. Part Layout

After the parts are assembled, we have to lay out the parts.

D. ROUTING

This is our main task. After we have laid out the layout, we will perform ROUTING.

E. Final Finishing

After ROUTING, we will use FABLINK to finally sort out the various data we need.

F. Convert GERBER

Convert to GERBER documents required by PC board manufacturers.

G. data archive
After all the work is completed, the data will be archived for future revision and verification.