LAYER

Rigid PCB:   1-56Layers (FR- 4, FR-406, 370-HR,EM-827,IT-180A,etc. )

High frequency high speed：   1-20Layers (Rogers, Aluminum/ Copper Base, TEFLON)

Buried/Blind Via:   4-36 layers,

Flex & Rigid-Flex PCB：2-36 layers

MATERIAL

FR- 4 HTG, FR-406, FR-408, FR408HR, 370-HR, EM-827, IT-180A, Panasonic M4/M6/M7, Rogers All Serials, Bergquist Thermal Clad, Dupont material,

FINISH THICKNESS

0.008″ – 0.275″ (0.2mm- 7mm)

MIN THICKNESS

2- layer: 0.008″ (0.2mm)

4- layer: 0.016″ (0.4mm)

6- layer: 0.024″ (0.6mm)

8- layer: 0.032″ (0.8mm)

10- layer: 0.04″ (1mm)

More than 10layers (0.5Xnumber of layers X0.008″)

SURFACE FINISHING

Lead Finishing: HASL, HASL+Gold finger

Lead- free Finishing: Lead- free HASL, ENIG,ENEPIG; OSP, Immersion silver,Immersion Tin

SPECIAL PROCESS

Impedance board (request as± 8%) Gold finger+beveling edge. Half-holes, plated PCB edge,countersink,

MAX / MIN BOARD SIZE

• 1- 2 Layers Max : 59″ x 24″ / Min: 0.2″ x 0.2″Content
• 4- 6 Layers Max : 32″ x 24″ / Min: 0.4″ x 0.4″
• 8 layers above Max : 30″ x 24″ / Min: 0.4″ x 0.4

INNER LAYERS (TRACE WIDTH/CLEARANCE)

• 0.5oz: 2/ 2mil
• 1oz: 3/ 3mil
• 2oz: 5/ 5mil
• 3oz: 7/ 7mil
• 4oz: 8/ 8mil
• 5oz 10/10mil
• 6oz 12/12mil

OUTER LAYERS (TRACE WIDTH/CLEARANCE)

• 1/ 3oz: 2/ 2mil
• Hoz: 3/3mil
• 1oz: 5/ 5mil
• 2oz: 8/ 8mil
• 3oz: 10/ 10mil
• 4oz: 12/ 12mil
• 5oz: 14/ 14mil
• 6oz: 16/ 16mil

ASPECT RATIO

Through hole: 16:1
HDI: 0.8/1

BOARD THICKNESS

0.008″ – 0.275″ (0.2mm- 7mm)

MIN HOLE RING (INNER)

• 0.5oz: 4mil
• 1oz: 5mil
• 2oz: 8mil
• 3oz: 12mil
• 4oz: 15mil
• 5oz: 18mil
• 6oz: 20mil

COPPER THICKNESS

Inner: H0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz. 6oz

Outer: 1/ 3oz, 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz

THICKNESS OF PLATING LAYER

• HASL:1-25um
• Copper Thickness in hole:
  IPC Class 2: 18um(Min.),20um(AVG)
  IPC Class 3: 20um(Min.),25um(AVG)
• ENIG: Nickel 120u” -280 u”, Gold 2u” -6u” according to IPC 4552
• Plated Hard Gold: Nickel 120u” -280 u”, Gold 4u” -100u”
• Immersion Silver: 8u” -20u” according to IPC 4553A
• Immersion Tin: 4u” -5u” according to IPC 4554
• ENEPIG:Nickel 120u” -240 u”, Gold 2u”(min.),Pd 3u”-6u” according to IPC 4556
• OSP: 8u” -20u”

SOLDER MASK COLOR

Glossy: Green, Black, Red, Yellow, White, Purple, Blue,

Matt: Green, Black

PROFILE

• Punch Tol: ±4mil, Slot Min: 32mil
• CNC Tol: ±4mil, Slot Min: 32mil
• V- CUT Tol: Registration:±4mil, remaining Thk: +/-2mil,Angel: 30°, 45°, 60°
• Bevel Edge:Depth Tol: ±4mil, Angel:+/-5°

STANDARD STACK UP

SOLDER MASK RESOLUTION

• Solder Mask Thickness: 0.3mil -1.6mil
• Solder Dam: Green 3mil /Other Color 4mil
• Solder Mask Hole Plug Diameter: 6mil -20mil

MIN HOLE SIZE

6 mil

ACCEPT STANDARD

IPC-A-600 Class 2 Latest revision or IPC-A-600 Class 3 Latest revision