10 Common Problems Frequently Encountered in Circuit Board Proofing Design (Part 2)

6. There are too many filler blocks in the design or the filler blocks are filled with very thin lines
Easily lead to the phenomenon of light drawing data loss, incomplete light drawing data, or a considerable amount of light drawing data generated, which increases the difficulty of data processing.

7. the pad design is too short
This is for continuity testing. For surface mount devices that are too dense, the spacing between the two pins is quite small, and the pads are also quite thin. The test pins must be installed up and down (left and right) in a staggered position. If the design of the pad is too short, although it will not affect the device installation, it will make the test pins not staggered.

8. Large-area grid spacing is too small
The large-area grid spacing is too small (less than 0.3mm), in the circuit board manufacturing process, after the image transfer process, it is easy to produce a lot of broken films attached to the board, causing wire breakage.

9. the large area of copper foil is too close to the outer frame
The distance between the large area of copper foil and the outer frame should be at least 0.2mm, otherwise it is easy to cause the copper foil to warp and the solder resists falling off caused by it.

10. the shaped hole is too short
The length/width of the special-shaped hole should be ≥2:1, and the width should be <1.0mm; otherwise, the drilling machine will easily break the drilling when processing the special-shaped hole, which will cause processing difficulties and increase the cost.
The above are ten problems that are easy to encounter when designing circuit boards. Do you understand all of them?

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