Precautions for Using SMT Components (Part 2)

Matters needing attention when baking:

For SMD (SOP, SOJ, PLCC, QFP, etc.) packed in plastic tubes, the packaging tube is not resistant to high temperature and cannot be directly put in the oven for baking.

It should be placed in a metal tube or metal tray for baking.

QFP’s packaging plastic tray has two types: non-high temperature resistant and high temperature resistant.

High temperature resistant (with Tmax=135°C, 150°C, or 180°C) can be directly put into the oven for baking, and those that are not resistant to high temperature can not be directly put into the oven to bake to prevent accidents and should be placed separately Bake in a metal pan.

The pins should be prevented from being damaged during transfer, so as not to damage the working surface.

Requirements when picking up SMT components

During transportation, material separation, inspection or manual mounting, if the staff needs to take SMT devices, they should wear an anti-static wrist strap, try to use a suction pen to operate, and pay special attention to avoid bumping the pins of SOP, QFP and other devices. Prevent pin warping and deformation.

How to save the remaining SMD

• Equipped with a dedicated low-temperature and low-humidity storage box. Store the unused SMD or the feeder in the box after opening. However, it is more expensive to equip a large-scale dedicated low-temperature and low-humidity storage tank.
• Use the original intact packaging bag. As long as the bag is not damaged and the desiccant inside is good (all the black circles on the temperature indicator card are blue and no pink), the unused SMD can still be repacked into the bag, and then sealed with tape.

As a professional FPC soft board manufacturer, XPCB Limited is so honored to have worked together with many of you. At XPCB Limited we are always more than ready to assist our new customers in any way we can.  Please feel free to contact us at any time if you have any questions.