What Is the Thermal Resistance Requirement of FPC Flexible Board

FPC voltage resistance test needs to be connected to the circuit to test its current transmission capability and the ability to withstand voltage, high current shrapnel micro pin module as a connection module, can be in the range of 1-50A, current transmission and conduction, overcurrent capability, but also has a stable connection. Not only is the conductivity strong, but also has a reliable response in the field of small pitch, can adapt to the pitch value between 0.15mm-0.4mm, the contact is stable and not stuck pin, the average service life can reach more than 20w times.

What is the thermal impedance of FPC flexible board?

Insulation resistance of double-layer FPC: >=500M ohms.

Thermal insulation resistance: a. At room temperature: >=500M ohms. b. After wet heat treatment: >=100M ohms. c. After wet heat treatment: >=100M ohms. d. After wet heat treatment: >=100M ohms.

Solderability: 260±5℃, 3~5s, 100% wetting.

Thermal shock test: 260±5℃*10s*3 times, oozing Sn. No delamination, no bubbles.

The number of applications of FPC flexible board in smart phones is high, the battery, screen, fingerprint module, camera are required to use FPC, FPC flexible board basic test standards are.

1. the appearance of the substrate film surface, cover layer;

2. the deviation of the connection plate and the cover layer, the flow of the binder and the cover layer, the conductor discoloration under the cover layer;

3. temperature and humidity resistance, voltage resistance, bending resistance and welding resistance are in accordance with the requirements;

4. Poor plating bonding, coating layer leakage, etc.

The above is a compilation of the “What Is the Thermal Resistance Requirement of FPC Flexible Board”, I hope it will help you, if there are any problems, please contact our customer service assistant.