Why We Need PCB Production Technology

Now, more and more people hope that small electronic products have more advanced functions. PCB production has also undergone tremendous changes in technology, from a thick and rigid structure to a thin and flexible type. However, since the trend of product size reduction has not decreased, even a thin and flexible PCB is not enough. Manufacturers are now using increasingly mature manufacturing techniques to manufacture multilayer boards. The more typical is the high-density interconnect (HDI) board, which constitutes the backbone of the electronics industry.

As long as the electronic products are large, traditional printed circuit boards (made by pcb) and even complex PCBs are sufficient. However, with the emergence of modern smart phones, wearable devices and the Internet of Things (IoT), people are increasingly inclined to choose thinner and smaller products. Component manufacturers are actively responding to this trend by making their products smaller.

For example, today’s mobile phones are thinner and lighter than most mobile phones a few years ago. Even so, their functions are far superior to their predecessors. This is because they are now using internal HDI pcb production, which can accommodate more components and provide significantly improved functions.

XPCB Limited is a manufacturer specializing in the production of high-precision double-sided, multi-sided and impedance, blind buried vias, and thick copper circuit boards. The products cover HDI, thick copper, backplanes, rigid-flex combined, buried capacitance and buried resistance, golden Finger and other kinds of circuit boards, which can meet the needs of customers for all kinds of products.