About Double-Sided Immersion Gold PCB Circuit Board

During the production, the cost of immersion gold board is relatively high, and the immersion gold process is not required under normal circumstances. So how do we distinguish which PCB board requires immersion gold? What kind of circuit board does not require immersion gold? It can be analyzed and judged according to the following situations.

1. The board has gold fingers that need to be gold-plated, but the layout other than the gold fingers can be tin-sprayed or immersed gold according to the situation, which is the usual “Immersion gold + gold-plated fingers” process and “spray tin + gold-plated fingers” process, occasionally a small number of designers choose to save costs or time is pressing to choose the full-page immersion gold method to achieve their goals, but the immersion gold does not reach the thickness of the gold plating, if the gold fingers often Insertion and stripping will cause poor connection.

2. The board’s line width pad spacing is insufficient. In this case, it is often difficult to produce with the tin spraying process. Therefore, for the performance of the board, the process of immersion gold is usually used, and this basically does not happen.

3. Immersion gold or gold plating. Because there is a layer of gold on the surface of the pad, the solderability is good and the board performance is also stable.

The disadvantage is that immersion gold is more expensive than conventional tin spraying, and it is usually more expensive if the thickness of the gold exceeds the standard of the plate factory. Gold plating is more expensive, but it works well.

XPCB Limited is a manufacturer specializing in the production of high-precision double-sided, multi-layer and impedance, blind buried vias, and thick copper circuit boards. The products cover HDI, thick copper, backplanes, rigid-flex combined, buried capacitance and buried resistance, Golden Finger and other types of circuit boards, which can meet the needs of customers for various products.