Analyze Common Testing Items of PCB Circuit Board

We know that each product of the circuit board manufacturer is formed through multiple processing and testing. The following is an introduction to the common testing items and points to be noted for PCB.

• Hole Copper Oxidation:

Slight discoloration does not affect the acceptance of tin.

Severe discoloration, such as blackening, redness, and rusting of the gold surface, is not acceptable to the circuit board manufacturer.

• Hole Copper Missing PAD/Gold-Plated:

Any PAD that needs to be plated but not plated with gold/nickel will not be accepted by the circuit board manufacturer.

• Poor Drilling:

Non-through holes do not affect the acceptance of assembly

Via hole: A. 90° destruction is allowed. B. 90° destruction at the junction of the pad and the wire, the line width is reduced by no more than 20%.

• PAD Position On Solder Mask:

Except for golden fingers, two points on each side of S/M on PAD can be connected, but each point shall not be larger than 0.2mm square.

• Poor Hole Copper:

The thickness of the hole copper should meet the SPEC requirements, and it should be continuous, and there must be no breaks and holes that are not conductive. The circuit board manufacturer can use slices to observe the thickness of the hole copper.

• Leaks and Extral Holes:

Check with the pattern or template. The circuit board manufacturers will not accept the extral or leak holes.

• Damaged PAD:

The damaged area of the PAD must not exceed 1/10 of the area of the PAD, and the number of damaged PADs must not exceed 5% of the total number of PADs.

XPCB Limited is a manufacturer specializing in the production of high-precision double-layer, multi-layer and impedance, blind buried vias, and thick copper circuit boards. The products cover HDI, thick copper, backplanes, rigid-flex, and buried capacitance. Various types of circuit boards such as, Golden Finger, etc. can meet the needs of customers for various products.