In the PCBA package processing production process, often need to use SMD adhesive, solder paste, stencil and other auxiliary materials, these auxiliary materials in the PCBA package the entire assembly production process, the product quality, production efficiency plays a vital role.
1. Shelf Life
Under the specified conditions, the material or product can still meet the technical requirements and maintain the appropriate performance of the storage time.
2. Working Time
The longest period of time during which the adhesive or solder paste can maintain the specified chemical and physical properties after being exposed to the specified environment before use.
3. Viscosity
The adhesive property of the dripping ductility of the adhesive and solder paste during natural dripping.
4. Thixotropy Ratio
Chip adhesive and solder paste has the characteristics of a fluid when extruded under pressure, but quickly becomes solid plastic after extrusion or stop applying pressure. This property is called thixotropy.
5. Slump
After the printing of the solder paste due to gravity and surface tension and the role of temperature or parking time is too long and caused by the height of the reduction, the bottom area beyond the specified boundary of the slump phenomenon.
6. Spread
The distance that the adhesive spreads at room temperature after dispensing.
7. Tack
The size of the adhesion of the solder paste to the component and the change in adhesion with the change in storage time after the printing of the paste.
8. Wetting
The state of the molten solder forming a thin layer of uniform, smooth and unbroken solder on the copper surface.
9. No-clean Solder Paste
A solder paste that contains only a trace of harmless solder residue after soldering and does not require cleaning of the PCB.
10. Low Temperature Paste
Solder paste with melting temperature below 163℃.
XPCB Limited is an electronic processing enterprise specializing in SMT chip processing, DIP common processing, PCBA package, PCB circuit board manufacturing, with many years of experience in electronic processing, as well as advanced production equipment and perfect after-sales service system. The enterprise’s SMT placement processing capacity reaches 1 million pieces per day, and DIP plug-in processing capacity is 200,000 pieces per day, which can provide you with quality electronic processing services.
XPCB Limited is a premium PCB & PCBA manufacturer based in China.
We specialize in multilayer flexible circuits, rigid-flex PCB, HDI PCB, and Rogers PCB.
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