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2022-01-10

Description And Reasons of Poor Plating During Electroplating 1/3

Description And Reasons of Poor Plating During PCB Electroplating: 1. Pinhole. The pinholes are due to the hydrogen adsorbed on the surface of the plated parts, […]

2022-01-10

Description And Reasons of Poor Plating During Electroplating 3/3

Description And Reasons of Poor Plating During PCB Electroplating: 21. Mold contamination of the plating solution (more common in nickel plating tanks, because the environment of […]

2022-01-10

Description And Reasons of Poor Plating During Electroplating 2/3

Description And Reasons of Poor Plating During PCB Electroplating: 11. Recess plating. There are sparse and dense irregular cavities on the surface of the coating (different […]

2022-01-08

Process Technology for Improving the Quality of Multilayer Board Laminating (1)

Due to the rapid development of electronic technology, the continuous development of printed circuit technology has been promoted. PCB boards have developed through single-sided-double-sided and multi-layered […]