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2021-12-25

PCB Multilayer Circuit Board Production Process (2)

B. Decontamination and Copper Sinking Purpose: Metallize the through hole 1. The substrate of the circuit board is composed of copper foil, glass fiber, and epoxy […]

2021-12-25

PCB Multilayer Circuit Board Production Process (1)

The purpose of blackening and browning: A. Remove contaminants such as oil and impurities on the surface. B. Enlarge the surface of the copper foil, thereby […]

2021-12-24

Components Can be Printed Directly on the PCB

We all know the methods for mounting ICs on PCB, mainly including through hole (THT) and chip (SMT). In addition to IC, there are many other […]

2021-12-24

Why We Use Immersion Gold Board Process for PCB Board

Why We Use Immersion Gold Board Process for PCB Board In order to solve the above problems of gold-plated boards, PCB using gold-plated boards mainly have […]