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2021-11-17

Blind And Buried Via PCB Factory HDI PCB Processing

The specifications of modern electronic devices (such as wearable electronic devices) require blind buried via circuit board factories to adopt multi-layer HDI PCB buried blind via […]

2021-11-17

Advantages of Microporous HDI PCB Production

The advantages of microporous HDI PCB production include achieving very high path density with fewer layers, because traces and vias have a relatively small size. In […]

2021-11-16

The Difference Between The Positive And Negative of Impedance Board

Orinary circuit boards can be divided into single-sided boards, double-sided boards, and multi-layer boards according to their structure. According to their hardness, they can be divided […]

2021-11-16

How to Solve The Electromagnetic Interference Caused By the PCB Multilayer Circuit Board

When the small relay on the PCB frequently disconnects the large current, arc discharge will occur, which will cause strong electromagnetic interference, which not only affects […]