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2021-09-03

What are the poor soldering of BGA in processing?

I believe that many engineers really want to know what are the undesirable phenomena in BGA soldering, and how to distinguish and identify them? The following […]

2021-09-02

Precautions for Using SMT Components (Part 1)

XPCB Limited carries out internal quality control in strict accordance with ISO requirements. After the components or parts assisted by external processing are purchased into the […]

2021-09-02

Common Pad Shape and Size Standards for PCB Design (Part 2)

XPCB Limited design capabilities The highest signal design rate: 10Gbps CML differential signal; The highest number of PCB design layers: 40 layers; Minimum line width: 2.4mil; […]

2021-09-02

Common Pad Shape and Size Standards for PCB Design (Part 1)

The pad is the basic unit of PCB surface mount assembly. On the printed circuit board, the circuit connections of all components are carried out through […]