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2021-08-11

Detailed Explanation of PCB Multilayer Circuit Board Manufacturing Process (Part 2)

Then press the pre-designed positioning system to carry out CNC drilling. After drilling, the hole wall should be etched and de-drilled, and then the process of […]

2021-08-11

Detailed Explanation of PCB Multilayer Circuit Board Manufacturing Process (Part 1)

As electronic products demand more and more functions, the structure of pcb circuit boards is becoming more and more complex. Due to the space limitation of […]

2021-08-10

the Advanced Technology of PCB Multilayer Circuit Board (Part 3)

The TCD process mainly includes the following technical content: 　　 A. Plug hole technology 　　Before the screen printing thermosetting ink, the inner through holes should be […]

2021-08-10

the Advanced Technology of PCB Multilayer Circuit Board (Part 2)

2. Thermosetting ink layering technology (referred to as TCD technology) 　　 TCD technology is a new technology for making SBU layer in HDI board by using […]