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2021-09-18

In-Depth Analysis of the Soldering Quality of QFN Packages (Part 1)

QFN (Quad Flat Noleads, Quad Flat Noleads) seems to have a more and more common trend in IC packaging in the electronic industry today. The advantage […]

2021-09-18

In-Depth Analysis of the Soldering Quality of QFN Packages (Part 2)

2. QFN solderability inspection and testing Just like the BGA solder inspection standards, the current solder inspection of QFN packages not only […]

2021-09-18

The Main Faults and the Parameters of the Chip Capacitors

1. The main manifestations of chip capacitor failure In the actual maintenance of SMD capacitors, the main failures of capacitors are as follows: Open circuit failure […]

2021-09-16

How to avoid the Parts Falling on the First Side During the Second Reflow Soldering of SMT (Part 4)

4. Adopt the method of mixing high and low solder paste In fact, XPCB Limited does not recommend this method, because the solder strength of low-temperature […]