2021-07-12

Introduction to the Manufacturing Process of Build-up Multilayer Boards (Part 2)

2. Multilayer multilayer board manufacturing process The main difference between BUM and the traditional PCB manufacturing process lies in the hole forming method. The key technologies […]
2021-07-12

Introduction to the Manufacturing Process of Build-up Multilayer Boards (Part 1)

1. What is a build-up multi-layer board (BUM-PCB)? Build up Multilayer PCB (BUM) refers to the insulation substrate, or the traditional double-sided or multi-layer board, which […]
2021-07-12

Tutorial For Good Hardware Circuit Design Ideas To Share

We have learned a lot of knowledge about components, but we still can’t design the circuit we want at will. This is a problem that troubles […]
2021-07-09

Tutorial: How To Avoid Wave Soldering

Why does PCB board appear tin after wave soldering? How do you avoid it? Once the PCB design is done, all is well? In fact, it […]