2021-06-29

The Problem of Precision Coincidence of Multilayer Blind Buried Hole PCB

Multi-layer blind buried and blind hole structure printed circuit boards are generally completed by the “sub-board” production method, which means that it must be completed through […]
2021-06-28

PCB Circuit Board Bonding Basic Concept and Process Requirements

PCB circuit board bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip […]
2021-06-28

Common Problems and Solutions During PCBA Processing

SMT patch processing is the core technology in the SMT process, and the speed of patch processing often restricts the production line’s capacity. An SMT chip […]
2021-06-07

Introduction For The PCB Assembly Process Circuit Board Blister Cause

In the process of PCBA circuit board assembly, causing a large reason for the foaming of the circuit board surface is the problem of poor binding […]