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2022-04-27

The Difference And Connection Between PCBA, SMT and PCB

Many people who are just beginning to contact the electronics industry are often confused by PCBA, SMT, and PCB. It is difficult to distinguish the difference […]

2022-04-27

Analysis of Causes of Excessive Chloride Ion Consumption in Electroplating Copper

At present, with the development of high-density and high-precision printed circuit boards, more stringent requirements are placed on the sulfate copper plating process. Various factors in […]

2022-04-27

Copper Clad Laminate Puts Forward New Requirements for Epoxy Resin Performance (3)

The technical content of realizing the performance requirements of the epoxy resin used in the thinning of CCL is relatively high. The CCL thinning technology is […]

2022-04-26

Copper Clad Laminate Puts Forward New Requirements for Epoxy Resin Performance (2)

What are the technical development characteristics of HDI multilayer boards? Knowing this will help us to study the requirements for the performance of its substrate materials […]