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2022-03-26

Analysis of The Causes of Blistering On The Surface of Copper Immersion Plating on PCB Boards (1)

Blistering on the board surface is one of the more common quality defects in the production process of circuit boards. Because of the complexity of the […]

2022-03-25

Analysis of PCB Vacuum Etching Technology (1)

An Improved Etching Technique for Ultra-Fine Structures By Frank Baron and Ron Salerno The etching process is one of the basic steps in the PCB production […]

2022-03-25

Analysis of PCB Vacuum Etching Technology (2)

The vacuum here refers to the negative pressure in the operating area of the system and the low suction just enough to prevent the puddled effect […]

2022-03-25

How to Deal With Virtual Welding and Cold Welding Defects Caused by SMT Patch

Welding defects such as virtual welding and cold welding sometimes occur in electronic processing. These permissions will lead to poor welding of SMT patches. How to […]