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2022-03-04

TCD Process of PCB

TCD process mainly includes the following technical contents: A. Plug Hole Technology Before screen printing the thermoset ink, the through holes of the inner layer should […]

2022-03-04

Semi-Additive Method for Making Precise Fine Wires and Blind Hole Filling Technology by Electroplating of PCB

Semi-Additive Method for Making Precise Fine Wires: The main process flow of the semi-additive method is: electroless copper on the whole board (generally, the thickness of […]

2022-03-04

The Development Advantages of Horizontal Electroplating

The development of horizontal electroplating technology is not accidental, but an inevitable result of the need for special functions of high-density, high-precision, multi-functional, high-aspect-ratio multilayer printed […]

2022-03-03

PCB Horizontal Electroplating Process for High-Precision Circuit Boards (3)

According to the characteristics of horizontal electroplating, it is an electroplating method in which the way of placing the printed circuit board is changed from vertical […]