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2022-03-03

PCB Horizontal Electroplating Process for High-Precision Circuit Boards (2)

Under the action of the electric field, the ions in the electroplating solution are subjected to electrostatic force to cause ion transport, which is called ion […]

2022-03-03

PCB Horizontal Electroplating Process for High-Precision Circuit Boards (1)

With the rapid development of microelectronics technology, the manufacturing of printed circuit boards is developing in the direction of multi-layer, lamination, functionalization and integration, which makes […]

2022-03-02

Surface Treatment of PCB Board Surface: Introduction of Horizontal Spray Tin SMOBC&HAL (3)

The Thickness of Horizontal Spray Tin is Divided Into Three Types: 2.54mm(100mil), 5.08mm(200mil), 7.62mm(300mil), the thickness of tin can be measured by micro-slicing: after fine polishing, […]

2022-03-02

Surface Treatment of PCB Board Surface: Introduction of Horizontal Spray Tin SMOBC&HAL (2)

Pre-Cleaning Treatment: It is mainly to clean the copper surface by micro-etching. The depth of micro-etching is generally 0.75-1.0 microns. At the same time, the attached […]