Correct Way to Dissipate Heat from the Flexible Circuit Board (FPC)

Flexible circuit board, also known as FPC, flexible printed circuit board, flexible circuit board, referred to as soft board or FPC, PCB LAYOUT training has the characteristics of high wiring density, light weight, and thin thickness. Mainly used in mobile phones, notebook computers, PDAs, digital cameras, LCMs and many other products.
FPC flexible printed circuit has three main characteristics of flexibility, reliability and economy. It is made of polyimide or polyester film with high reliability and excellent flexibility. Printed circuit.

Generally, FPC circuit boards can be divided into single-sided boards, double-sided boards, multi-layer boards, rigid-flex boards and special craft boards in terms of structure and technology according to the requirements of industrial production. So in the application, the following  principles need to be followed for heat dissipation of the flexible circuit board.

1.  In the direction of air flow, components that are more sensitive to heat should be distributed in the “upstream” position.
2.  Disperse the components that are far away from the heat, so that the heat per unit area is smaller.
3. Place the heat source as close as possible to the cooling surface.
4.  In the case of forced air convection, taller components should be distributed downstream of the heat source.
5.  In the case of forced air convection, the downstream high components should have a certain distance from the heat source.
6. In the case of using forced air convection, the tall and long elements should be aligned with the air flow direction.