Desoldering Skills for SMT Chip Processing

What are the desoldering techniques for SMT patch processing? Generally speaking, it is not so easy to remove the SMT chip processing components. Continue to practice regularly to master it, otherwise, it is easy to damage the SMD components if forcibly disassembled. Mastering these skills, of course, takes practice.

The desoldering techniques for SMT patch processing are as follows:

1. For components with few SMD component feet, such as resistors, capacitors, diodes, triodes, etc., tin plate one of the pads on the PCB first, and then use tweezers to hold the components in the left hand and place them in the installation position and press against the circuit board. Solder the pins on the tinned pads with a soldering iron with your right hand. The left-hand tweezers can be loosened, and the remaining feet can be soldered with tin wire instead. If you want to disassemble such components, it is also easy to use a soldering iron to heat both ends of the component at the same time. After the tin has melted, you can remove the component with a gentle lift.

2. For SMT chip processing components with more pins, and chip components with wider spacing, a similar method is also used. First, tin one pad is plated, and then the left-hand uses tweezers to hold the component and solder one foot. OK, then solder the rest of the feet with tin wire. The disassembly of such components is generally better with a hot air gun. One hand holds the hot air gun to blow and melt the solder, and the other hand uses a clamp such as tweezers to remove the components when the solder melts.

3. For components with high pin density, the soldering steps are similar, that is, solder one foot first, and then solder the remaining feet with tin wire. The number of pins is relatively large and dense, and the alignment of pins and pads is the key. The pads on the corners are usually selected, and only a little tin is plated. Use tweezers or hands to align the components with the pads, and the edges with pins are aligned. Press the components on the PCB board with a little force, and solder the tin with a soldering iron. Solder the corresponding pins of the plate.

Finally, it is recommended that the disassembly of high pin density components mainly use a heat gun, clamp the components with tweezers, blow all the pins back and forth with the heat gun, and lift the components when they are all melted. If the removed components are still needed, try not to face the center of the components when blowing, and the time should be as short as possible. Clean the pads with a soldering iron after the components are removed.