Detailed Explanation of PCB Multilayer Circuit Board Manufacturing Process (Part 2)

Then press the pre-designed positioning system to carry out CNC drilling. After drilling, the hole wall should be etched and de-drilled, and then the process of double-sided plated hole printed circuit board can be carried out. 　　

Compared with the general multi-layer board and double-sided board production process, the main difference is that the multi-layer board adds several unique process steps: inner layer imaging and blackening, lamination, etch back and de-drilling. In most of the same processes, certain process parameters, equipment accuracy and complexity are also different. For example, the inner metallization connection of the multi-layer board is the decisive factor for the reliability of the multi-layer board, and the quality requirements for the hole wall are stricter than that of the double-layer board, so the requirements for drilling are higher.

In addition, the number of stacks for each drilling of the multi-layer board, the speed and feed rate of the drill bit during drilling are different from those of the double-sided board. The inspection of finished and semi-finished multi-layer boards is also much stricter and more complicated than double-sided boards. Due to the complex structure of the multi-layer board, a glycerin hot-melt process with uniform temperature should be used instead of an infrared hot-melt process that may cause excessive local temperature rise.

Multilayer pcb circuit board is the product of the development of electronic technology in the direction of high speed, multi-function, large capacity and small volume. As a professional multi-layer pcb circuit processing manufacturer,XPCB Limited will continue to improve the production process and strive for the rise of the electronics manufacturing industry.