Four Special Electroplating Methods for Circuit Board Production (Part 2)

3. Reel Linkage Type Selective Plating The pins and pins of electronic components, such as connectors, integrated circuits, transistors, and flexible printed circuits, all use selective plating to obtain good contact resistance and corrosion resistance. This electroplating method can be manual or automatic. It is very expensive to selectively plate each pin individually, so batch welding must be used. Usually, the two ends of the metal foil that is rolled to the required thickness are punched, cleaned by chemical or mechanical methods, and then selectively used like nickel, gold, silver, rhodium, button or tin-nickel alloy, copper-nickel alloy , Nickel-lead alloy, etc. for continuous electroplating. In the electroplating method of selective plating, first coat a layer of resist film on the part of the metal copper foil board that does not need to be electroplated, and electroplating only on the selected part of the copper foil.

4. Brush Plating  Another method of selective plating is called “brush plating”. It is an electrodeposition technique, and not all parts are immersed in the electrolyte during the electroplating process. In this kind of electroplating technology, only a limited area is electroplated, and there is no effect on the rest. Usually, rare metals are plated on selected parts of the printed circuit board, such as areas such as board edge connectors. Brush plating is used more when repairing discarded circuit boards in electronic assembly workshops. Wrap a special anode (a chemically inactive anode, such as graphite) in an absorbent material (cotton swab), and use it to bring the electroplating solution to the place where electroplating is needed.

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