How to Improve High-Precision Technology of Printed Circuit Boards?

How to Improve High-Precision Technology of Printed Circuit Boards?

The printed circuit board is a high-tech technology, and the precise positioning of the production circuit is very important. The production of circuit boards with buried and blind hole structures requires multiple pressing, drilling, and hole plating to complete, so it is recommended to make precise positioning at the beginning. Let’s share with you how to improve high-precision technology.

In addition to increasing the number of wiring on the board, buried, blind, and through-hole technology is also an important way to increase the density of the circuit board.

Generally, buried and blind holes are tiny holes. Buried and blind vias use the “nearest” inter-layer interconnection, which greatly reduces the number of through-holes, and the isolation disk settings are greatly reduced, thereby increasing the number of effective wiring and inter-layer interconnections in the board, and improving the interconnection and high-density.

Therefore, the multi-layer board with a combination of buried, blind, and through holes has at least three times higher interconnection density than the conventional full-through hole structure. Under the same technical indicators, buried, blind, and through hole, the size of the circuit board combined will be greatly reduced or the number of layers will be significantly reduced.

As a result, circuit boards are increasingly used in high-density printed boards for exterior devices, and more and more buried and blind hole technologies are used not only in exterior device printed boards in large computers, communication equipment, etc., but also in civil and industrial applications. It has also been widely used in the field of use, and even in some thin boards.

XPCB Limited is a manufacturer specializing in the production of high-precision double-sided, multi-layer and impedance, blind buried vias, and thick copper circuit boards. The products cover HDI, thick copper, backplanes, rigid-flex combined, buried capacitance and buried resistance, Golden Finger and other kinds of circuit boards, which can meet the needs of customers for all kinds of products.