Introduction of Assembled IC Socket Form for SMT Chip Processing

With the rapid development of surface assembly technology and chip components, the types and quantity of chip components have increased significantly, becoming the mainstream products of electronic components. There is a relatively complex component in SMT chip processing, that is IC. IC has always been a troublesome component in electronic processing. There are also IC sockets in SMT processing. Below, I will introduce the two forms of IC sockets processed by SMT.

One is designed for plug-in, which converts surface mount ICs into jack mounts.

Adapter sockets are a good choice when a surface mount package is desired on a fully interposer board. In this way, an existing assembly line can be used to assemble a complete circuit board instead of developing a new assembly board that only mounts surface mount devices.

Another form of socket is designed for surface mounting.

It has roughly the same land pattern as the original package, so if properly designed, the board can either mount the IC directly or mount an interchangeable socket. Such sockets are commonly used in early production general-purpose ROM chips.

There is no metallic bond between the socket and the component leads, but rely on mechanical contact, so they are not as strong as soldering. Such contacts can corrode in high humidity environments, mechanical contacts can break in shock or vibration, and sockets are expensive, so not every component is considered a socket, but only when it makes sense.