The COB package on the PCB circuit board, if the bare chip is directly exposed to the air, is susceptible to pollution or man-made damage, affecting or destroying the function of the chip, so the chip and bonding wires are encapsulated with glue. This form of encapsulation is also called soft encapsulation. The full name of COB package is Chips on Board (COB), which is a technology to solve the problem of LED heat dissipation. its electrical connection.
1. What is COB soft packaging
Careful netizens may find that there will be a black thing on some circuit boards, so what is this thing? Why is it on the circuit board, and what does it do? In fact, this is a kind of encapsulation. We often call it soft encapsulation. It is actually hard to say that it is made of epoxy resin. We usually see that the receiving surface of the receiving head is also made of this material. Inside is a chip IC. This process is called bonding, and we usually call it bonding. This is a wire bonding process in the chip production process, that is, chip-on-board packaging, which is one of the bare chip mounting technologies. The chip is mounted on the PCB circuit board using epoxy resin.
2. COB Soft Packaging Features
This kind of soft packaging technology is actually for cost. As the simplest bare chip mounting, in order to protect the internal IC from damage, this kind of packaging generally requires one-time molding, which is generally placed on the copper foil surface of the circuit board. It is round and the color is black. This packaging technology has the advantages of low cost, space saving, light and thin, good heat dissipation effect, and simple packaging method. Many integrated circuits, especially most low-cost circuits, only necessary to draw more wires from the integrated circuit chip, and then hand it over to the manufacturer to place the chip on the circuit board, weld it with a machine, and then glue it to cure and harden.
3. Application
This package has its own unique characteristics, so some electronic circuits, such as MP3 players, electronic organs, digital cameras, game consoles, etc., also use this package in some circuits that pursue low cost. In fact, COB soft packaging is not only limited to chips, but also widely used in LED, such as COB light source, which is an integrated surface light source technology that is directly attached to the mirror metal substrate on the LED chip.
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