PCB Circuit Board Printing Common Problems

The circuit board screen printing process can be divided into 9 parts and 56 variables, which requires everyone to have the correct operating procedures or the following phenomena will occur.

• No matter how the screen is pulled, it can’t be pulled evenly, or bursts often appear.
• The mesh cloth and the screen frame are not firmly adhered, dry slowly, or cannot be torn off.
• The 110 mesh on the screen is easy to fall off, or burst automatically, burst or fall off during drying.
• There are many meshes or translucent meshes on the template.
• There are jagged edges on the image on the template. Diverse types of jagged.
• When the template image is washed, part of it cannot be washed away, or it can be washed away completely.
• The substrate is not aligned with the original film, large or small, top, bottom, left, and right, and only one side is aligned.
• It is easy to stick to the board during printing, or the image is vague.
• The image of the lines on the template is like an earthworm that is bent unevenly.
• When printing a single-layer board, the number of prints is low, and the photosensitive glue partly falls off.
• When printing multi-layer boards, the number of prints is low, the meshes gradually increase, the glue is dropped, the printing is missed, the printing is not in place, and the most serious is the screen burst.
• The solder mask comes off.
• Overdeveloped solder mask cover pressure.
• The solder mask has bubbles or wrinkles.
• The surface of the solder mask is fogged, dark and dull.
• The text ink is easy to fall off.
• The text is ambiguous and there are missing prints.
• The jagged edges of the lines are largely missing.
• The phenomenon of sticking network appears in the printing of single and multi-layer boards.

XPCB Limited is a manufacturer specializing in the production of high-precision double-sided, multi-layer and impedance, blind buried vias, and thick copper circuit boards. The products cover HDI, thick copper, backplanes, rigid-flex combined, buried capacitance and buried resistance, Golden Finger and other types of circuit boards, which can meet the needs of customers for various products.