PCB Layer Setting and Power Ground Splitting Requirements

PCB Layer Setting and Power Ground Splitting Requirements:

1. Vertical wiring rules must be defined when two signal layers are directly adjacent.

2. The main power supply layer is adjacent to its corresponding ground layer as much as possible, and the power supply layer meets the 20H rule.

3. Each wiring layer has a complete reference plane.

4. The multi-layer board is stacked and the core material (CORE) is symmetrical to prevent the uneven distribution of the copper skin density and the asymmetric thickness of the medium from warping.

5. The thickness of the board should not exceed 4.5mm. For the board thickness greater than 2.5mm (the backplane is greater than 3mm), the technicians should confirm that there is no problem in PCB processing, assembly and equipment. The thickness of the PC card board is 1.6mm.

6. When the thickness-diameter ratio of the via is greater than 10:1, it should be confirmed by the PCB manufacturer.

7. The power supply and ground of the optical module are separated from other power supplies and grounds to reduce interference.

8. The power supply and ground processing of key devices meet the requirements.

9. When there are impedance control requirements, the layer setting parameters meet the requirements.