PCB Prototyping or Small and Medium Batch Circuit Board Production Process (2)

7. Double-sided spray tin plate of PCB board
Cutting material — baking board — drilling — copper sinking — pattern transfer — electric copper, tin — etching — tin stripping — light board test — etching QC — photosensitive green oil — silk screen characters — Tin spraying – punching board or gong board – V-CUT – finished product testing – FQC – FQA – packing and shipping

8. Double-sided spray tin gold finger board
Cutting material — baking board — drilling — copper sinking — circuit — electric copper, tin — etching — tin stripping — etching QC — photosensitive green oil — silk screen characters — electric gold finger — Tin spraying – punching board or gong board – V-CUT – gold finger beveled edge – finished product testing – FQC – FQA – packing and shipping

9. Double-sided immersion gold (gold) plate
Cutting material — baking board — drilling — copper sinking — one full board electroplating — photosensitive circuit — electric copper, tin — etching — stripping tin — light board test — etching QC — photosensitive green oil ——silk screen characters——immersion gold (chemical gold)——Punching plate or gong plate——V-CUT——finished product testing——FQC——FQA——packaging and shipping

10. Double-sided immersion silver and immersion tin plate
Cutting material — baking board — drilling — copper sinking — photosensitive circuit — electric copper, tin — etching — tin stripping — light board test — etching QC — photosensitive green oil — silk screen characters — Punching board or gong board – V-CUT – finished product testing – immersion silver (immersion tin) – FQC – FQA – packaging and shipping

11. Double-sided anti-oxidation board (OSP)
Cutting material – baking plate – drilling – copper sinking – photosensitive circuit – copper plating, tin – etching – tin stripping – light plate test – etching QC – photosensitive green oil – silk screen characters – Punching board or gong board – V-CUT – finished product test – anti-oxidation (OSP) – FQC – FQA – packing and shipping

12. Multilayer board

Cutting material – baking board – inner layer circuit – inner layer etching – etching QC – inner layer AOI – browning or blackening – pressing – drilling – removing glue residue – sinking copper (The subsequent process is the same as that of the double-sided panel)