PCB Single-Layer/ Two-Layer/ Multilayer Circuit Board Production Process

Sometimes we think that the production process of printed circuit boards is very complicated. XPCB Limited will give you an analysis of the production process of vaguely printed circuit boards. First of all, we need to know the function and role of the printed circuit board. The first step is to provide a base for the completion of the first level of assembly and other necessary electronic circuit parts to form a module or finished product with a specific function. Therefore, the printed circuit board process is used in all electronic product, almost all kinds of electronic equipment, from electronic watches, to computers, to communication electronic equipment, and to military weapon systems. As long as there are electronic components such as integrated circuits, for the electrical interconnection between them, it will be used.

The production process of printed circuit boards is generally divided into three types: single-layer, double-layerand multi-layer boards. Different factories with different production processes call it differently, but the principle of the process flow is the same!

The single-layer production process is easier to understand than the double-layer process. Basically, it is cutting -drilling -graphics transfer -etching -solder mask and printing-metal surface treatment -finished product molding -testing and inspection -packaging Shipment.

The overall process of double-sided board production is cutting -drilling -electroless copper plating and copper plating -graphics transfer -pattern plating and protective tin plating-etching -intermediate inspection -solder mask – printing characters -metal surface treatment -finished product molding -electrical testing -appearance inspection -packaging and shipment.

The multi-layer board process is to increase the inner layer process before the double-layer process. The basic process is cutting -inner layer graphics transfer -inner layer etching -inner layer etching inspection -copper surface oxidation treatment -typesetting and lamination board -pressing board -cutting board forming -followed by double-sided board process.

The above is the production process of printed circuit boards. It has developed from single-layer to double-layer and multi-layer boards, and have maintained their respective development trends. Because it has been continuously developing in the direction of high precision and high density, continuously reducing the volume, reducing the cost, and better using the printed circuit board in the future development of electronic equipment, it will continue to have strong vitality.