PCB Technology Roadmap

ITEM	Description
LAYER	Rigid PCB: 1-56Layers (FR- 4, FR-406, 370-HR,EM-827,IT-180A,etc. ) High frequency high speed： 1-20Layers (Rogers, Aluminum/ Copper Base, TEFLON) Buried/Blind Via: 4-36 layers, Flex & Rigid-Flex PCB：2-36 layers
MATERIAL	FR- 4 HTG, FR-406, FR-408, FR408HR, 370-HR, EM-827, IT-180A, Panasonic M4/M6/M7, Rogers All Serials, Bergquist Thermal Clad, Dupont material,
FINISH THICKNESS	0.008" - 0.275" (0.2mm- 7mm)
MIN THICKNESS	2- layer: 0.008" (0.2mm) 4- layer: 0.016" (0.4mm) 6- layer: 0.024" (0.6mm) 8- layer: 0.032" (0.8mm) 10- layer: 0.04" (1mm) More than 10layers (0.5Xnumber of layers X0.008")
SURFACE FINISHING	Lead Finishing: HASL, HASL+Gold finger Lead- free Finishing: Lead- free HASL, ENIG,ENEPIG; OSP, Immersion silver,Immersion Tin
SPECIAL PROCESS	Impedance board (request as± 8%) Gold finger+beveling edge. Half-holes, plated PCB edge,countersink,
MAX / MIN BOARD SIZE	1- 2 Layers Max : 59" x 24" / Min: 0.2" x 0.2"Content 4- 6 Layers Max : 32" x 24" / Min: 0.4" x 0.4" 8 layers above Max : 30" x 24" / Min: 0.4" x 0.4
INNER LAYERS (TRACE WIDTH/CLEARANCE)	0.5oz: 2/ 2mil 1oz: 3/ 3mil 2oz: 5/ 5mil 3oz: 7/ 7mil 4oz: 8/ 8mil 5oz 10/10mil 6oz 12/12mil
OUTER LAYERS (TRACE WIDTH/CLEARANCE)	1/ 3oz: 2/ 2mil Hoz: 3/3mil 1oz: 5/ 5mil 2oz: 8/ 8mil 3oz: 10/ 10mil 4oz: 12/ 12mil 5oz: 14/ 14mil 6oz: 16/ 16mil
ASPECT RATIO	Through hole: 16:1 HDI: 0.8/1
BOARD THICKNESS	0.008" - 0.275" (0.2mm- 7mm)
MIN HOLE RING (INNER)	0.5oz: 4mil 1oz: 5mil 2oz: 8mil 3oz: 12mil 4oz: 15mil 5oz: 18mil 6oz: 20mil
COPPER THICKNESS	Inner: H0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz. 6oz Outer: 1/ 3oz, 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz
THICKNESS OF PLATING LAYER	HASL:1-25um Copper Thickness in hole: IPC Class 2: 18um(Min.),20um(AVG) IPC Class 3: 20um(Min.),25um(AVG) ENIG: Nickel 120u" -280 u", Gold 2u" -6u" according to IPC 4552 Plated Hard Gold: Nickel 120u" -280 u", Gold 4u" -100u" Immersion Silver: 8u" -20u" according to IPC 4553A Immersion Tin: 4u" -5u" according to IPC 4554 ENEPIG:Nickel 120u" -240 u", Gold 2u"(min.),Pd 3u"-6u" according to IPC 4556 OSP: 8u" -20u"
SOLDER MASK COLOR	Glossy: Green, Black, Red, Yellow, White, Purple, Blue, Matt: Green, Black
PROFILE	Punch Tol: ±4mil, Slot Min: 32mil CNC Tol: ±4mil, Slot Min: 32mil V- CUT Tol: Registration:±4mil, remaining Thk: +/-2mil,Angel: 30°, 45°, 60° Bevel Edge:Depth Tol: ±4mil, Angel:+/-5°
STANDARD STACK UP
SOLDER MASK RESOLUTION	Solder Mask Thickness: 0.3mil -1.6mil Solder Dam: Green 3mil /Other Color 4mil Solder Mask Hole Plug Diameter: 6mil -20mil
MIN HOLE SIZE	6 mil
ACCEPT STANDARD	IPC-A-600 Class 2 Latest revision or IPC-A-600 Class 3 Latest revision

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PCB Technology Roadmap

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