Several Common Integrated Circuit Packaging Forms

In the process of integrated circuit design and manufacturing, packaging is an indispensable part, and it is also the final stage of semiconductor integrated circuits. By encapsulating the core die of the device in a support, it can not only effectively prevent physical damage and chemical corrosion, but also provide external connection pins, so that the chip can be more conveniently mounted on the circuit board. What are the types of integrated circuit packaging?

1. SOP- Small Outline Package

SOP, also called SOL and DFP, is a very common form of components. At the same time, it is also one of the surface mount packages, and the pins are led out from both sides of the package in a seagull wing shape (L shape). Packaging materials are divided into two types, that is plastic and ceramic. It started in the late 1970s.

The SOP package has a wide range of applications. In addition to its use in memory LSIs, SOPs are the most popular surface mount packages in areas where input and output terminals do not exceed 10-40. Later, in order to meet the needs of production, SOJ, SSOP, TSSOP, SOIC and other small outline packages were gradually derived.

2. PGA- Pin Grid Array Package

PGA chip packaging is commonly used in the packaging of microprocessors. Generally, the integrated circuit (IC) is packaged in a ceramic chip. The bottom of the ceramic chip is arranged in square pins, and these pins can be inserted and soldered to the circuit board. The corresponding socket is very suitable for applications that require frequent wave insertion. For chips with the same pins, the PGA package usually requires a smaller area than the common dual in-line package in the past.

The PGA package has the characteristics of more convenient plug-in operation, high reliability and adaptability to higher frequencies. The early Pentium chips, the 80486 in the InTel series CPU and the Pentium and Pentium Pro all use this package.

3. BGA- Ball Grid Array Package

The BGA package is an improvement from the PGA pin grid array. It is a package method in which a certain surface is arranged in a grid pattern to cover the pins. The electronic signal can be transmitted from the integrated circuit to the the printed circuit board on which it is located. In the BGA package, the pins at the bottom of the package are replaced by solder balls. These solder balls can be configured manually or through an automated machine, and they can be positioned through flux.

The BGA package can provide more pins than other packages such as dual in-line packages or quad flat packages. The bottom surface of the entire device can be used as pins, which can be shorter than the surrounding package types. The average wire length in order to have more high-speed performance.

4. DIP- Dual In-Line Package

The so-called DIP dual in-line package refers to the integrated circuit chip packaged in the dual in-line form. Most small and medium-sized integrated circuit ICs use this packaging form, and the number of pins generally does not exceed 100. The CPU chip adopting DIP package has two rows of pins, which need to be inserted into the chip socket with DIP structure. The DIP packaged chip should be carefully inserted and removed from the chip socket to avoid damage to the pins.

DIP package has the following characteristics:

1. Suitable for perforation welding on PCB (printed circuit board), easy to operate.

2. The ratio between the chip area and the package area is larger, so the volume is also larger. The 8088 in the Intel series of CPUs uses this type of packaging. Cache and the early memory chip industry use this type of packaging.

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