SMT is the surface assembly technology, which is currently the most popular technology and patch process in the electronics assembly industry. So, what are the SMT chip processing solutions?
Characteristics of SMT Patch Processing
- With high assembly density, small size and light weight of electronic products, the volume and weight of chip processing components are only about 1/10 of that of traditional plug-in components.
- High reliability, strong anti-vibration ability, and low solder joint defect rate.
- Good high frequency characteristics, reducing electromagnetic and radio frequency interference.
- It is easy to realize automation and improve production efficiency.
- Reduce costs by 30%~50%, save materials, energy, equipment, manpower, time, etc.
SMT circuit board installation plan
- The SMT processing method and process are completely different from the installation method and process of through-hole insertion. At present, in the electronic products that apply SMT technology, some are circuit boards that all use SMT components; but there is also the so-called “mixed process”, that is, on the same circuit board, there are existing THT components inserted , And there are surface-mounted SMT components.
Three SMT chip processing solutions
- All adopt surface mounting. There are no through-hole plug-in components on the printed circuit board, and various SMDs and SMCs are mounted on one or both sides of the circuit board.
- Double-sided mixed installation On the A side of the printed circuit board, there are both through-hole plug-in components and various SMT components; on the B side of the printed circuit board, only small SMD transistors and SMC components are assembled.
- Install on both sides separately On the A side of the printed board, only through-hole plug-in components are installed, while the small SMT components are mounted on the B side of the printed board.
