The Introduction of the Content and Level of Electronic Product Assembly Processing

The assembly of equipment in electronic processing is the process of attaching various electronic components, electromechanical components, and structural parts in accordance with design requirements in specified positions to form a complete electronic product with certain functions.

Assembly Content and Level of Electronic Assembly Processing

1. The assembly content of electronic equipment includes:

(1) Division of unit circuits;
(2) Layout of components;
(3) Installation of various components, parts and structural parts;
(4) Combined assembly of the whole machine

2. Electronic equipment assembly level

In the assembly process, the assembly of electronic equipment is divided into different levels according to the size, size, complexity and characteristics of the assembly unit. The assembly level of electronic equipment in an electronic finished product assembly plant is as follows.

Level 1 Component level

Features: The assembly level is the lowest, and the structure is indivisible. Mainly general circuit components, discrete components, integrated circuits, etc.

Level 2 Plug-in level

Features: Used for assembling and interconnecting level 1 components. For example, circuit boards and plug-ins equipped with components.

Level 3 Subrack board level

Features: Used to install and interconnect plug-ins or printed circuit board components of level 2 assembly.

Level 4 Cabinet level

Features: The second and third levels of assembly are interconnected by electric rupture and connectors to form an independent device with certain functions.

[Note 1]: When assembling at different levels, the meaning of the components will change. For example, when assembling a printed circuit board, components such as resistors, capacitors, and transistors are the assembling components, while when assembling the bottom plate of the equipment, the printed circuit board is the assembling component.

[Note 2]: For a specific electronic device, it may not be available at all assembly levels, but to consider which level is applied according to the specific situation.