Two SMOBC Processes

The following mainly introduces the SMOBC process and the plugging method SMOBC process flow of the pattern electroplating method and then the lead and tin stripping.

1. The L process method of pattern electroplating method and lead and tin stripping:

The SMOBC process of pattern electroplating followed by lead and tin stripping is similar to the pattern electroplating process. Changes only after etching.

Double-sided copper clad board → according to the pattern electroplating process to the etching process → lead and tin removal → inspection → cleaning → solder mask pattern → plug nickel plating and gold plating → plug sticking tape → hot air leveling → cleaning → screen printing marking symbols → shape processing → Washing and drying → Finished product inspection → Packaging → Finished product.

2. The main process flow of plugging method is as follows:

Double-sided foil-clad board→drilling→chemical copper plating→copper plating on the whole PCB board→hole blocking→screen printing imaging (positive image)→etching→removing screen printing material, removing blocking material→cleaning→solder mask pattern→plug nickel plating, Gold-plating → plug tape → hot air leveling → the following procedures are the same as the above to the finished product.

The process steps of this process are relatively simple, and the key is to plug the holes and wash the ink that plugs the holes.

In the hole plugging process, if the hole plugging ink and screen printing imaging are not used, but a special masking dry film is used to cover the hole and then exposed to make a positive image, this is the masking hole process. Compared with the hole plugging method, it no longer has the problem of cleaning the ink in the hole, but it has higher requirements for masking the dry film.